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2013card

Overview

  • 90x55mm business card with mobius.io logo on the front and SMT protoboard on the back
  • 1.27mm x 0.65mm pitch on grid to accommodate both SOIC and TSSOP components
  • 64 pin IDC pads on the side, card designed to fit between 2.54mm spaced pins
  • mini-usb connector footprint
  • 32qfp and 80tqfp footprints which will accommodate smaller components
  • LED-WHITE solder mask which should retain white color even after heating
  • Gerbers are available here

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2013card.txt · Last modified: 2015/04/05 22:32 (external edit)